Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
1～6 item / All 6 items
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
A wedge is a tool used in wedge bonding. Wedge bonding is a method of joining a wire to an electrode using ultrasonic vibrations and pressure transmitted from a transducer to the bonding tool. Typically, tungsten carbide (WC) is used for aluminum wire, while titanium carbide (TiC) is used for gold wire.
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
This is a comprehensive catalog featuring a wide variety of tabletop wire bonders from TPT, ideal for research and development with high-precision bonding and excellent operability. With this single unit, both wedge bonding and ball bonding are possible. We also offer various bonding tools such as capillaries and wedge tools. Please feel free to consult us for sample requests or tool selection. 【Featured Products】(Partial Introduction) ○ Tabletop Wire Bonder → Semi-auto / Manual / Full Manual / Wedge for Thick Wire ○ Bonding Tools → YAG Laser Thin Film Processing System → Photon Emission Microscope System and more For further details, please download the catalog or contact us.
MPP supplies products to over 400 customers in 20 countries across a wide range of fields, including microelectronics, medical, military, and aerospace.
MPP was founded in Israel and has over 40 years of experience and know-how since its establishment. MPP's products are used in a wide range of fields, including microelectronics, medical, military, and aerospace, supplying products to over 400 customers in 20 countries. We provide high-quality, high-precision, and highly reliable products at low prices.
This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.
The width of the tip can be less than 0.1mm. The thermal conductivity of single crystal diamond is over 1000 W/mK. Diamond has exceptional performance compared to other materials with high thermal conductivity. (For reference: Silver 420, Copper 398, Gold 320, Aluminum 236) It also possesses a high hardness that is essential for tools used repeatedly, with a Vickers hardness of over 8,000. (For reference: Ceramic (SiC) approximately 2,300, Carbide approximately 2,000)
Supporting the growing IoT industry! Providing packaging and assembly solutions for products!
We introduce solutions specialized for the IoT industry offered by Micro Point Pro Co., Ltd. The "fine wire wedge bonding tool" guarantees high yield and stable bonding results. Continuous development of materials and design allows for the optimization of bonding performance.
We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.
Micro Point Pro Co., Ltd. has 40 years of experience and expertise since its establishment, and offers a wide range of products for the semiconductor and microelectronics device assembly industry. Based in Israel, it is supported by 150 employees and 600 employees from group companies. MPP covers all manufacturing processes from raw materials to finished products and has numerous achievements with many global companies. 【Products Offered】 ■ Wedge bonding tools (fine wire and heavy wire wedge tools) ■ Die collet ■ Manual wire bonders ■ Pick & place and flip chip tools ■ Dispensers & solder jet ball tools ■ Surface mount dispensers & nozzles
